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Checked by:
Category:
Language:
English
Total Size:
406.9 MB
Info Hash:
4A9E8828475FDB7957562F59675E57A7B66C100E
Added By:
Added:
Oct. 24, 2023, 2:06 p.m.
Stats:
|
(Last updated: May 15, 2025, 5:59 p.m.)
| File | Size |
|---|---|
| Get Bonus Downloads Here.url | 176 bytes |
| 1. SELF INTRODUCTION.mp4 | 6.1 MB |
| 1. SELF INTRODUCTION.srt | 593 bytes |
| 2. OVERVIEW OF COURSE CONTENTS.mp4 | 7.3 MB |
| 2. OVERVIEW OF COURSE CONTENTS.srt | 1.4 KB |
| 3. WHAT IS ELECTRONICS PACKAGING & ITS 2 BROAD CATEGORIES.mp4 | 20.9 MB |
| 3. WHAT IS ELECTRONICS PACKAGING & ITS 2 BROAD CATEGORIES.srt | 2.7 KB |
| 4. WHY DO WE NEED DEVICE PACKAGING COATING .mp4 | 12.6 MB |
| 4. WHY DO WE NEED DEVICE PACKAGING COATING .srt | 1.3 KB |
| 5. APPLICATIONS OF MATERIALS IN ELECTRONICS PACKAGING.mp4 | 10.5 MB |
| 5. APPLICATIONS OF MATERIALS IN ELECTRONICS PACKAGING.srt | 1.3 KB |
| 6. HIERARCHY OF ELECTRONICS PACKAGING.mp4 | 19.2 MB |
| 6. HIERARCHY OF ELECTRONICS PACKAGING.srt | 1.9 KB |
| 7. 3 PACKAGING VARIATIONS CARD DCAM MCML.mp4 | 11.4 MB |
| 7. 3 PACKAGING VARIATIONS CARD DCAM MCML.srt | 1.3 KB |
| 8. CONCEPT OF CHIP FIRST & CHIP LAST.mp4 | 8.9 MB |
| 8. CONCEPT OF CHIP FIRST & CHIP LAST.srt | 703 bytes |
| 1. SINGLE-IN-LINE DUAL-IN-LINE ZIGZAG-IN-LINE QUAD -IN-LINE CONFIGURATIONS.mp4 | 6.4 MB |
| 1. SINGLE-IN-LINE DUAL-IN-LINE ZIGZAG-IN-LINE QUAD -IN-LINE CONFIGURATIONS.srt | 3.1 KB |
| 2. CERAMIC-FLAT-PACK SURFACE-MOUNT GRID-ARRAY-MATRIX CONFIGURATIONS.mp4 | 14.3 MB |
| 2. CERAMIC-FLAT-PACK SURFACE-MOUNT GRID-ARRAY-MATRIX CONFIGURATIONS.srt | 1.7 KB |
| 1. INTRODUCTION TO SUBSTRATE MATERIALS CERAMIC POLYMERES METALS COMPOSITES.mp4 | 37.4 MB |
| 1. INTRODUCTION TO SUBSTRATE MATERIALS CERAMIC POLYMERES METALS COMPOSITES.srt | 4.2 KB |
| 2. VARIOUS TYPES CERAMIC SUBSTRATE MATERIALS.mp4 | 19.3 MB |
| 2. VARIOUS TYPES CERAMIC SUBSTRATE MATERIALS.srt | 2.4 KB |
| 3. ELECTRONIC GLASS.mp4 | 21.3 MB |
| 3. ELECTRONIC GLASS.srt | 2.9 KB |
| 1. INTRODUCTION TO PCB.mp4 | 9.3 MB |
| 1. INTRODUCTION TO PCB.srt | 1023 bytes |
| 2. TYPES OF CIRCUIT BOARD & ITS APPLICATIONS.mp4 | 19.9 MB |
| 2. TYPES OF CIRCUIT BOARD & ITS APPLICATIONS.srt | 2.4 KB |
| 3. FR4 PCB BOARD.mp4 | 5.6 MB |
| 3. FR4 PCB BOARD.srt | 1.9 KB |
| 1. USE OF GELVET OVER CONVENTIONAL TIMs.mp4 | 17.1 MB |
| 1. USE OF GELVET OVER CONVENTIONAL TIMs.srt | 2.0 KB |
| 2. TECHNICAL DETAILS & CERTAIN DRAWBACKS OF GELVET TIMs.mp4 | 14.7 MB |
| 2. TECHNICAL DETAILS & CERTAIN DRAWBACKS OF GELVET TIMs.srt | 1.6 KB |
| 1. INTRODUCTION TO MMCs.mp4 | 12.0 MB |
| 1. INTRODUCTION TO MMCs.srt | 2.3 KB |
| 2. Al-DIAMOND MMC.mp4 | 11.8 MB |
| 2. Al-DIAMOND MMC.srt | 1.6 KB |
| 3. Al-SiC MMC.mp4 | 11.1 MB |
| 3. Al-SiC MMC.srt | 1.8 KB |
| 4. Al-Si MMC.mp4 | 5.7 MB |
| 4. Al-Si MMC.srt | 887 bytes |
| 5. Cu-DIAMOND MMC.mp4 | 9.7 MB |
| 5. Cu-DIAMOND MMC.srt | 1.5 KB |
| 6. Al-GRAPHITE MMC.mp4 | 9.2 MB |
| 6. Al-GRAPHITE MMC.srt | 1.0 KB |
| 7. GOLD-GOLD INTERCONNECTION (GGI).mp4 | 14.3 MB |
| 7. GOLD-GOLD INTERCONNECTION (GGI).srt | 1.3 KB |
| 8. ROLE OF DIAMOND.mp4 | 14.9 MB |
| 8. ROLE OF DIAMOND.srt | 1.8 KB |
| 9. CARBON NANO TUBES (CNTs).mp4 | 17.7 MB |
| 9. CARBON NANO TUBES (CNTs).srt | 2.0 KB |
| 1. MATERIALS USED IN PCM.mp4 | 6.1 MB |
| 1. MATERIALS USED IN PCM.srt | 2.5 KB |
| 1. ADVANCED MATERIALS USED FOR EMI SHIELDING IN ELECTRONICS.mp4 | 9.6 MB |
| 1. ADVANCED MATERIALS USED FOR EMI SHIELDING IN ELECTRONICS.srt | 849 bytes |
| 1.1 RESOURCE.pdf | 3.9 MB |
| 1. CONCLUSION.mp4 | 14.2 MB |
| 1. CONCLUSION.srt | 1.5 KB |
| 2. CLOSING SESSION.mp4 | 4.6 MB |
| 2. CLOSING SESSION.srt | 819 bytes |
| Bonus Resources.txt | 357 bytes |
Name
DL
Uploader
Size
S/L
Added
-
2.7 GB
[11
/
3]
2025-01-13
| Uploaded by FreeCourseWeb | Size 2.7 GB | Health [ 11 /3 ] | Added 2025-01-13 |
-
3.8 GB
[3
/
17]
2024-10-24
| Uploaded by FreeCourseWeb | Size 3.8 GB | Health [ 3 /17 ] | Added 2024-10-24 |
-
1.7 GB
[20
/
5]
2024-02-29
| Uploaded by FreeCourseWeb | Size 1.7 GB | Health [ 20 /5 ] | Added 2024-02-29 |
-
354.4 MB
[19
/
10]
2024-02-15
| Uploaded by FreeCourseWeb | Size 354.4 MB | Health [ 19 /10 ] | Added 2024-02-15 |
NOTE
SOURCE: Udemy Advanced Materials For Electronics Packaging
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COVER
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MEDIAINFO
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