Torrent details for "Lau J. Advanced Substrates, Failure Mechanisms, and Thermal Mana…" Log in to bookmark
Controls:
×
Report Torrent
Please select a reason for reporting this torrent:
Your report will be reviewed by our moderation team.
×
Report Information
Loading report information...
This torrent has been reported 0 times.
Report Summary:
| User | Reason | Date |
|---|
Failed to load report information.
×
Success
Your report has been submitted successfully.
Checked by:
Category:
Language:
None
Total Size:
74.8 MB
Info Hash:
766199E5B741493212679744802653D69CB6E296
Added By:
Added:
July 6, 2025, 4:28 p.m.
Stats:
|
(Last updated: July 6, 2025, 4:28 p.m.)
| File | Size |
|---|---|
| ['Lau J. Advanced Substrates, Failure Mechanisms, and Thermal Management...2025.pdf'] | 0 bytes |
Name
DL
Uploader
Size
S/L
Added
-
32.0 MB
[12
/
3]
2024-07-14
| Uploaded by indexFroggy | Size 32.0 MB | Health [ 12 /3 ] | Added 2024-07-14 |
-
74.8 MB
[32
/
27]
2025-07-06
| Uploaded by andryold1 | Size 74.8 MB | Health [ 32 /27 ] | Added 2025-07-06 |
-
23.7 MB
[32
/
3]
2023-07-01
| Uploaded by indexFroggy | Size 23.7 MB | Health [ 32 /3 ] | Added 2023-07-01 |
-
761.1 MB
[27
/
21]
2026-03-12
| Uploaded by XXXClub | Size 761.1 MB | Health [ 27 /21 ] | Added 2026-03-12 |
NOTE
SOURCE: Lau J. Advanced Substrates, Failure Mechanisms, and Thermal Management...2025
-----------------------------------------------------------------------------------
COVER

-----------------------------------------------------------------------------------
MEDIAINFO
Textbook in PDF format The book focuses on the design, materials, process, fabrication, failure mechanism, reliability, modeling, and thermal management of chiplets and heterogeneous integration. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as hybrid bonding, advanced substrates, failure mechanisms, and modeling due to thermal stresses, moisture absorption, impact loading such as drop as well as electric current driven electromigration, and the fundamentals of thermal management. Each topic is treated with in-depth analysis to bridge foundational principles with real-world engineering challenges. This book is an essential resource for researchers, engineers, and students in electrical engineering, mechanical engineering, materials science, and industrial engineering, equipping them with the knowledge to advance innovation in semiconductor packaging and integration
×


